Dr. Sciammarella is an Associate Professor and the interim chair of the Mechanical Engineering Department at Northern Illinois University’s College of Engineering & Engineering Technology where his research is focused on laser enabled manufacturing. His research group was recently awarded a US patent for Laser Assisted Machining of Ceramics. He was the PI of a $2.4 M NIST Measurement Science in Additive Manufacturing award entitled “Development and Validation of Physics-Based Additive Manufacturing Models For Process Control and Quality Assurance” that was in collaboration with QCML, Northwestern University, IMEC, FMA, and ASM.
In 2011 he served as the competency area manager for the Laser Materials Processing Group that is part of the National Laser Centre at the Council for Scientific and Industrial Research (CSIR) in South Africa. Because of his research and education work with additive manufacturing, Sciammarella was chosen to be technical chair for the RAPDASA international conference held in South Africa in 2012 which focused on Additive Manufacturing. Later he led a core group of AM professionals in putting together a technology implementation roadmap for Additive Manufacturing in South Africa.
He now serves on the America Makes Roadmap Advisory Group for Additive Manufacturing (AM) and 3D Printing (3DP). This group will provide vision and direction to America Makes stakeholders and partners in order to accelerate AM and 3DP technologies and amplify our nation’s global manufacturing competitiveness.
Eighty-four percent of manufacturing executives agree – there’s a massive talent shortage in U.S. Manufacturing. If the skills gap is our biggest challenge, what are we doing as a community of manufacturing leaders to educate and onboard the next generation?
Join us at noon on Monday, September 10, 2018 on the main stage of the grand concourse as we bring together a diverse panel of the best and brightest minds to brainstorm the different ways we can inspire our future colleagues and solve this massive challenge.